Karkar, A;
Dahir, N;
Mak, T;
Tong, KF;
(2022)
Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era.
ACM Journal on Emerging Technologies in Computing Systems
, 18
(3)
, Article 49. 10.1145/3501771.
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Abstract
Due to the exceedingly high integration density of VLSI circuits and the resulting high power density, thermal integrity became a major challenge. One way to tackle this problem is Dark silicon. Dark silicon is the amount of circuitry in a chip that is forced to switch off to insure thermal integrity of the system and prevent permanent thermal-related faults. In many-core systems, the presence of Dark Silicon adds new design constraints, in general, and on the communication fabric of such systems, in particular. This is due to the fact that system-level thermal-management systems tend to increase the distance between high activity cores to insure better thermal balancing and integrity. Consequently, a designing dilemma is created where a compromise has to be made between interconnect performance and power consumption. This study proposes a hybrid wire and surface-wave interconnect (SWI) based Network-on-Chip (NoC) to address the dark silicon challenge. Through efficient utilization of one-hop cross the chip communication SWI links, the proposed architecture is able to offer an efficient and scalable communication platform in terms of performance, power, and thermal impact. As a result, evaluations of the proposed architecture compared to baseline architecture under dark silicon scenarios show reduction in maximum temperature by 15°C, average delay up to 73.1%, and energy-saving up to ~3X. This study explores the promising potential of the proposed architecture in extending the utilization wall for current and future many-core systems in dark silicon era.
| Type: | Article |
|---|---|
| Title: | Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era |
| Open access status: | An open access version is available from UCL Discovery |
| DOI: | 10.1145/3501771 |
| Publisher version: | https://doi.org/10.1145/3501771 |
| Language: | English |
| Additional information: | This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions. |
| Keywords: | Networks-on-chip, Dark silicon, Surface wave, Many-core systems, On-chip interconnects, Thermal reliability, Communication efficient, Multicast |
| UCL classification: | UCL UCL > Provost and Vice Provost Offices > UCL BEAMS UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Electronic and Electrical Eng |
| URI: | https://discovery.ucl.ac.uk/id/eprint/10159065 |
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