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oaioai:HAL:hal-00602867v1

Modelling of Through Silicon Via RF Performance and Impact on Signal Transmission in 3D Integrated Circuits

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Publication date
30 September 2009
Publisher
HAL CCSD

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International audienc

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Hal - Université Grenoble Alpes

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oaioai:HAL:hal-00602867v1
Last time updated on 22/08/2019

This paper was published in Hal - Université Grenoble Alpes.

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