Modular decomposition of the NOR-TSUM multiple-valued PLA

Abstract

A method for designing PLA-based combinational circuits by modular decomposition is presented. Main subjects are 1) Specific properties of TSUM operator, 2) MIN-TSUM and NOR-TSUM expansions with respect to the bound set, X1 of variables, 3) Realization of functions by multiple-valued PLA-based combinational circuits, 4) Comparison with other methods. Experimental investigations show that the size of suggested combinational circuit is the same as the size of multiple-valued PLA implementing a multiple-valued logic function with large number of variables