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Mr. Steve Rickman, NASA Technical Fellow for Passive Thermal, proposed a pathfinder study to develop an apparatus for wire and wire bundle thermal testing to measure their performance, and to support development of thermal analytical models. Development of such capability would enable wire and wire bundle amperage capacity. The goal of this study was to assess the feasibility of developing physics-based and regression thermal models of single wires and wire bundles. This report contains the outcome of the NESC assessment
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