Repository landing page

We are not able to resolve this OAI Identifier to the repository landing page. If you are the repository manager for this record, please head to the Dashboard and adjust the settings.

Reducing the carbon footprint of ICT products through material efficiency strategies: A life cycle analysis of smartphones

Abstract

With the support of a life cycle assessment model, this study estimates the carbon footprint (CF) of smartphones and life cycle costs (LCC) for consumers in scenarios where different material efficiency strategies are implemented in Europe. Results show that a major contribution to the CF of smartphones is due to extraction and processing of materials and following manufacturing of parts: 10.7 kg CO2,eq/year, when assuming a biennial replacement cycle. Printed wiring board, display assembly, and integrated circuits make 75% of the impacts from materials. The CF is increased by assembly (+2.7 kg CO2,eq/year), distribution (+1.9 kg CO2,eq/year), and recharging of the device (+1.9 kg CO2,eq/year) and decreased by the end of life recycling (−0.8 kg CO2,eq/year). However, the CF of smartphones can dramatically increase when the energy consumed in communication services is counted (+26.4 kg CO2,eq/year). LCC can vary significantly (235–622 EUR/year). The service contract can in particular be a decisive cost factor (up to 61–85% of the LCC). It was calculated that the 1:1 displacement of new smartphones by used devices could decrease the CF by 52–79% (excluding communication services) and the LCC by 5–16%. An extension of the replacement cycle from 2 to 3 years could decrease the CF by 23–30% and the LCC by 4–10%, depending on whether repair operations are required. Measures for implementing such material efficiency strategies are presented and results can help inform decision‐makers about how to reduce impacts associated with smartphones.This work has been financially supported by the European Commission through the Administrative Agreement N. 070201/2015/SI2.719458/ENV.A.1, signed by DG ENV and DG JRC

Similar works

This paper was published in TECNALIA Publications.

Having an issue?

Is data on this page outdated, violates copyrights or anything else? Report the problem now and we will take corresponding actions after reviewing your request.