We are not able to resolve this OAI Identifier to the repository landing page. If you are the repository manager for this record, please head to the Dashboard and adjust the settings.
Institute of Electrical and Electronics Engineers Inc.
Doi
Abstract
Fault management in digital chips is a crucial aspect of functional safety. Significant work has been done on gate and microarchitecture level triple modular redundancy, and on functional redundancy in multi-core and simultaneous-multi-threading processors, whereas little has been done to quantify the fault tolerance potential of interleaved-multi-threading. In this study, we apply the temporal-spatial triple modular redundancy concept to interleaved-multi-threading processors through a design solution that we call Buffered triple modular redundancy, using the soft-core Klessydra-T03 as the basis for our experiments. We then illustrate the quantitative findings of a large fault-injection simulation campaign on the fault-tolerant core and discuss the vulnerability comparison with previous representative fault-tolerant designs. The results show that the obtained resilience is comparable to a full triple modular redundancy at the cost of execution cycle count overhead instead of hardware overhead, yet with higher achievable clock frequency
Is data on this page outdated, violates copyrights or anything else? Report the problem now and we will take corresponding actions after reviewing your request.