Methodology for 3D full-wave simulation of electrostatic breakdown across an air gap

Abstract

The Rompe-Weizel SPICE model is used to obtain the time dependent arc resistance during simulation of air gap discharge. The SPICE model is solved using a circuit simulator, and the accompanying 3D model is solved using the transmission-line matrix time domain numerical method. Transient co-simulation is a new technique that is used to solve both circuit and 3D models at the same time. Transient co-simulation with the Rompe-Weizel SPICE model is first validated for different arc lengths using a simple geometry of a rod discharging to a ground plane. Validation is achieved by comparing the discharge currents from simulation with measurement. Next, a new simulation setup that uses a circuit switch along with the Rompe-Weizel model to capture the full physics of the Secondary ESD is tested. This simulation setup is tested by using an adjustable spark gap structure to generate Secondary ESD and validating it with measurements of the voltage across the gap and the discharge currents. Finally, the methodology is tested for practical usage by simulating the Secondary ESD in an actual smartphone product that is susceptible to secondary breakdown. The system level simulation predicts the coupling from ESD to a victim trace in the smartphone. Measurements performed at several stages of modeling the smartphone validate the simulation results. Using this novel methodology, the user can simulate secondary discharge in products to predict ESD damage and disruption on a system level --Abstract, page iv