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oaioai:scholarspace.manoa.hawaii.edu:10125/62292

A HEURISTIC FOR OPTIMIZING THE PHYSICAL LAYOUT AND NETWORK TOPOLOGY OF INTEGRATED 3D MULTI-CHIP SYSTEMS UNDER TEMPERATURE CONSTRAINTS

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Publication date
1 December 2018
Publisher
University of Hawaiʻi at Mānoa

Abstract

M.S. Thesis. University of Hawaiʻi at Mānoa 2018

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This paper was published in ScholarSpace at University of Hawai'i at Manoa.

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